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MB85RS64A
■ PACKAGE DIMENSION
8-pin pl as tic SOP
(FPT-8P-M02)
Le a d pitch
P a ck a ge width ×
p a ck a ge length
Le a d s h a pe
Se a ling method
Mo u nting height
Weight
1.27 mm
3.9 mm × 5.05 mm
G u llwing
Pl as tic mold
1.75 mm MAX
0.06 g
* 1 5.05 –0.20 .199 –.008
8-pin plastic SOP
(FPT-8P-M02)
+0.25 +.010
8
5
* 2 3.90±0.30 6.00±0.40
Note 1) * 1 : The s e dimen s ion s incl u de re s in protr us ion.
Note 2) * 2 : The s e dimen s ion s do not incl u de re s in protr us ion.
Note 3) Pin s width a nd pin s thickne ss incl u de pl a ting thickne ss .
Note 4) Pin s width do not incl u de tie b a r c u tting rem a inder.
+0.03
0.22 –0.07
+.001
.009 –.003
(.154±.012) (.236±.016)
45°
Det a il s of "A" p a rt
1.55±0.20
(Mo u nting height)
(.061±.008)
0.25(.010)
0.40(.016)
1
4
"A"
0~8°
1.27(.050)
0.44±0.08
(.017±.003)
0.13(.005)
M
0.50±0.20
0.15±0.10
0.10(.004)
(.020±.008)
0.60±0.15
(.024±.006)
Dimen s ion s in mm (inche s ).
(.006±.004)
(St a nd off)
C
2002-2010 FUJITSU SEMICONDUCTOR LIMITED F08004S-c-4-9
Note: The v a l u e s in p a renthe s e s a re reference v a l u e s .
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
18
DS501-00009-0v01-E
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